Interfacial epoxy microcapsulation system

Details Interfacial epoxy microcapsulation system Interfacial epoxy microcapsulation system

B - Operations, Transporting

01

J

42/14, 117/46.6

B01J 13/16 (2006.01) B41M 5/165 (2006.01)

Patent

CA 2007656

ABSTRACT OF THE DISCLOSURE An epoxy microcapsule comprising an oil core material and a microcapsule wall enclosing the oil core material. The micro- capsule wall is an interfacial polymerization product of an epoxy resin and a polyamino compound having multifunctional amino groups capable of crosslinking the epoxy resin. The epoxy resin is preferably bisphenol A or bisphenol F based epoxy resin. The polyamino compound preferably has primary and tertiary amino groups. The epoxy microcapsule can be used in carbonless copying systems.

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