Interlayer for transient liquid phase diffusion bonding

B - Operations – Transporting – 32 – B

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B32B 15/00 (2006.01) B23K 20/233 (2006.01) B23K 35/00 (2006.01)

Patent

CA 1056560

INTERLAYER FOR TRANSIENT LIQUID PHASE DIFFUSION BONDING ABSTRACT OF THE DISCLOSURE A reduced melting point interlayer for transient liquid phase diffusion bonding of the nickel, cobalt and iron alloys is provided as a thin coating integral with one or more of the surfaces to be joined. -1-

268015

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