Interposer assembly

H - Electricity – 01 – R

Patent

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Details

H01R 12/00 (2006.01)

Patent

CA 2553083

An interposer assembly (10) includes a dielectric plate (12) having a plurality of contact passages (14) extending through the plate with a contact (20) in each passage. Each contact is formed from a length of cylindrical preplated metal wire (37) having a small diameter. Interposer assemblies with contacts formed from small diameter wire contacts have reduced contact inductance and permit reduction of the thickness of the dielectric plate and of the spacing between adjacent contacts on the plate.

L'invention concerne un ensemble intermédiaire comprenant une plaque diélectrique dotée d'une pluralité de passages de contact s'étendant à travers ladite plaque, un contact étant disposé dans chaque passage. Chaque contact est formé d'une longueur de fil métallique cylindrique préplaqué de petit diamètre. Des ensembles intermédiaires dont les contacts sont formés à partir de contacts de fil de petit diamètre présentent une inductance de contact limitée et permettent de réduire l'épaisseur de la plaque diélectrique et de l'espacement entre des contacts adjacents disposés sur cette plaque.

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