Interposer assembly and method

Details Interposer assembly and method Interposer assembly and method

H - Electricity

01

R

H01R 12/71 (2011.01) H01R 12/91 (2011.01) H01R 13/24 (2006.01) H05K 10/00 (2006.01)

Patent

CA 2447814

An interposer assembly (10) includes a dielectric plate (12) having a plurality of contact passages (14) extending through the plate with a contact (20) in each passage. Each contact includes a pair of laterally spaced contact points (50) at the top and bottom of the plate. Sandwinching of the interposer assembly between two substrates (86) brings the contact points on each spring arm (42) into engagement with a pad (84), elastically bends the contacts and forms redundant high pressure wiped electrical connections between the contact points and pads.

L'invention concerne un ensemble interposeur (10) comprenant une plaque diélectrique (12) traversée par une pluralité de passages de contact (14) renfermant chacun un élément de contact (20). Chaque élément de contact est formé par une paire de points de contact (50) espacés latéralement, situés au sommet et à la base de la plaque. Lorsque l'ensemble interposeur est intercalé entre deux substrats (86), les points de contact sur chaque bras à ressort (42) entrent en prise avec une pastille (84), les éléments de contacts se plient de façon élastique et forment des connexions électriques essuyées à haute pression, redondantes, entre les points de contact et les pastilles.

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