Intrinsically conductive moulding compound

Details Intrinsically conductive moulding compound Intrinsically conductive moulding compound

C - Chemistry, Metallurgy

08

F

400/5145

C08F 2/04 (2006.01) C08G 61/12 (2006.01) H01B 1/12 (2006.01)

Patent

CA 2034738

(9) AE 6612 A B S T R A C T The invention relates to a process for the preparation of an intrinsically conductive moulding compound obtained by in situ polymerization of monomers which form an intrinsically conductive polymer after polymerization, in the presence of a matrix polymer and a catalyst, the matrix polymer being dissolved in an essentially solvent free monomer, after which the solution obtained is brought into the desired form and the monomers are polymerized in situ in the presence of a catalyst. Moulding compounds obtained with the process according to the invention can be used in batteries, electronic components (diodes, transistors), electrical wiring, coatings and in EMI-shielding attributes.

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