Ion implantation method

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/176

H01L 21/265 (2006.01) H01L 21/266 (2006.01) H01L 21/8238 (2006.01)

Patent

CA 1108311

ABSTRACT OF THE DISCLOSURE Ions are implanted into a body, such as semi- conductor substrate material, through one or more covering layers formed over the body. A thin conductive film is in contact with the covering layer prior to the ion implanta- tion. The ions are implanted into the material through the thin conductive film. The conductive film functions to conduct away any charge which tends to accumulate in the covering layer. The conductive film thereby prevents a charge accumulation which would tend to discharge through and cause damage to the covering layer. The method is particularly useful for fabricating MOS and CMOS semiconductor devices.

312282

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Ion implantation method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ion implantation method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ion implantation method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-430803

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.