H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/265 (2006.01) H01J 37/02 (2006.01) H01J 37/317 (2006.01)
Patent
CA 2129403
An ion implanting apparatus for irradiating a material, for example, a semiconductor wafer, with an ion beam generated at an ion source, for implanting the ion into the material, is provided with a magnet at a side of the material opposite to a side into which the ion is irradiated. Thereby, the implantation is performed without charging thereon and with a high yielding ratio.
Canon Kabushiki Kaisha
Ridout & Maybee Llp
LandOfFree
Ion implanting apparatus and ion implanting method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ion implanting apparatus and ion implanting method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ion implanting apparatus and ion implanting method will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1786390