Isolation chamber for electronic devices

Details Isolation chamber for electronic devices Isolation chamber for electronic devices

H - Electricity

05

K

347/4

H05K 5/00 (2006.01) F25B 21/02 (2006.01) F25B 29/00 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1145024

ABSTRACT OF THE DISCLOSURE The isolation chamber (100) has an aluminum outer housing (106) with heat transfer fins (110L, 110D, 110R) extending therefrom on the outside vertical surfaces, and insulation material (114) mounted along each inside surface thereof forming a thermally insulative shell. Large aluminum studs (118L, 118R, 118D) extend inwardly from the side surfaces of the housing through the insulative shell for supporting a solid state heat pump (122). Each pump has a set of inwardly directed heat exchange fins (126). Each stud and associated pump and inwardly directed set of fins forms a heat conductive path between the surrounding ambient air and the interior of the isolation chamber for controlling the heat flow therebetween. The combined configuration of the inner heat exchange fins defines a central cavity (140) which is temperature controlled to within a desired operating temperature range. A card cage (130) containing the electronic devices is installed in the temperature regulated central region. The atmosphere within the central region is isolated from the surrounding ambient air, and supports internal convective heat transfer between the electronic devices and the inner fins by recirculating throughout the card cage and between the inner heat transfer fins. The operating level of the heat pumps are adjustable to provide the most efficient pumping as the external temperature varies. The outer housing and card cage form a double walled electrically conductive structure which twice encloses the electronic devices for providing double shielding from electrical interference. The card cage is cushioned from external vibration by the absorption affect of the insulative shell material.

361796

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