Isothermal termination block having a multi-layer thermal...

Details Isothermal termination block having a multi-layer thermal... Isothermal termination block having a multi-layer thermal...

H - Electricity

05

K

356/3

H05K 7/20 (2006.01) G01K 7/12 (2006.01) H05K 1/02 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2026195

ABSTRACT An isothermal block has a multi-layer thermal conductor interleaved with different layers of a printed circuit board to provide improved thermal coupling of input terminals and a local temperature sensor mounted on the isothermal block. Each of the layers of the thermal conductor is substantially thinner than substrate layers of the printed circuit board. The layers of the thermal conductor are spaced apart from the terminals so as to be electrically isolated from the terminals. Embedded layers of the thermal conductor are spaced closer to the terminals than are external layers of the thermal conductor.

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