Jack-o-lantern forming system and method

Details Jack-o-lantern forming system and method Jack-o-lantern forming system and method

B - Operations, Transporting

26

D

146/57

B26D 3/00 (2006.01)

Patent

CA 1148072

JACK-O-LANTERN FORMING SYSTEM AND METHOD ABSTRACT A Jack-O-Lantern forming system (10) and method of producing a Jack-O-Lantern for cutting facial feature openings (14) in a pumpkin (12). At least one pumpkin die element (26) having a closed contour sidewall element (32) is provided. The sidewall element (32) has a lower edge (36) adapted for contiguous interface with the pumpkin outer surface contour (16). Addi- tionally, the pumpkin die element (26) has an upper edge (38) adapted to be impact loaded for displacing the pumpkin die element (26) through a wall (22) of the pumpkin (12). The die element (26) is impacted on the upper edge (38) and displaced through the wall (22) to provide a plug element which is removable and is contoured in the form of one of the facial feature openings (14). Through use of a number of differently MR459-2 contoured die elements (26), a wide variety of facial feature contour openings (14) may be provided in a minimal time reference frame. MR459-2

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