Jumper chip for semiconductor devices

Details Jumper chip for semiconductor devices Jumper chip for semiconductor devices

H - Electricity

01

L

356/183

H01L 23/48 (2006.01) H01L 21/48 (2006.01) H01L 23/492 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1277441

JUMPER CHIP FOR SEMICONDUCTOR DEVICES ABSTRACT In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold Alloy to the substrate, the bonding of the gold alloy to the substrate and to the gold coating of the cavity in a device package is improved. Scrubbing of the jumper chip on the gold coating of the cavity is obviated. The additional gold layers applied to the gold alloy are distinct and visible on a photograph of a cross-section of the jumper chip.

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