Junction substrate and method of bonding substrates together

Details Junction substrate and method of bonding substrates together Junction substrate and method of bonding substrates together

B - Operations, Transporting

01

J

B01J 19/00 (2006.01) C03C 17/22 (2006.01) C03C 17/34 (2006.01) C03C 27/00 (2006.01)

Patent

CA 2509912

A junction substrate includes a first substrate (1), a buffer film (2) formed on one surface of the first substrate, a metal containing film (3a) formed on the buffer film and having a lower resistance than the buffer film, and a second substrate (4) bonded to the other surface of the first substrate (1).

L'invention concerne un substrat à jonction composé d'un premier substrat (1), d'un film tampon (2) formé sur une surface du premier substrat, d'un film contenant du métal (3a), formé sur le film tampon et présentant une résistance inférieure à celle du film tampon, ainsi que d'un second substrat (4) lié à l'autre surface du premier substrat (1).

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