Kneaded moldable resin composition

Details Kneaded moldable resin composition Kneaded moldable resin composition

C - Chemistry, Metallurgy

08

L

400/5358

C08L 23/06 (2006.01) B29B 7/82 (2006.01) C08J 3/00 (2006.01) C08L 23/04 (2006.01) C08L 43/04 (2006.01) C08L 83/04 (2006.01) C08L 83/07 (2006.01) G06F 17/24 (2006.01) G06T 11/80 (2006.01)

Patent

CA 2019243

11 ABSTRACT OF THE DISCLOSURE Heat kneading of an ethylene polymer and an organopolysiloxane is described 100 weight parts of an ethylene polymer, and 0.01 - 300 weight parts of an organopolysiloxane expressed by the formula Image (A) (where R1 is an aliphatic unsaturated group, R2 is a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated group, 0<a<1, 0.5<b<3, and 1<a+b<3) are heat-kneaded. The heat kneading is carried out at a temperature Tp (°C) satisfying Tp<Tm+85 where the melting point of the ethylene polymer is represented by Tm (°C). The kneaded composition can be molded into films and tubes.

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