Kneaded moldable resin composition

Details Kneaded moldable resin composition Kneaded moldable resin composition

C - Chemistry, Metallurgy

08

L

400/4115

C08L 23/06 (2006.01) C08K 5/01 (2006.01) C08L 23/04 (2006.01) C08L 43/04 (2006.01) C08L 47/00 (2006.01) C08L 83/04 (2006.01)

Patent

CA 2019244

12 ABSTRACT OF THE DISCLOSURE A kneaded moldable resin composition which can be molded into films and tubes is described comprising 100 weight parts of an ethylene polymer; 0.01 - 300 weight parts of an organopolysiloxane expressed by the formula Image (A) (where R1 is an aliphatic unsaturated group, R2 is a substituted for unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated group, 0<a<1, 0.5<b<3, and 1<a+b<3); 0.01 - 30 weight parts of a hydrocarbon compound expressed by the formula CH2 = CH(CH2)cCH = CH2 (B) (where c is an integer of 1 - 30) which are heat-kneaded with each other.

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