L.e.d. thermal management

Details L.e.d. thermal management L.e.d. thermal management

H - Electricity

01

L

H01L 33/64 (2010.01) H05K 1/18 (2006.01)

Patent

CA 2342440

A circuit board (12) presents a hole (32) therethrough and surrounding each of a plurality of LEDs (20, 22, or 24). A heat sink (28) integral with each LED (20, 22, or 24) is disposed in thermal contact with a heat dissipater (30) for conveying heat from the LEDs (20, 22 and 24) to the heat dissipater (30). Each LED (20, 22, or 24) extends through the hold (32) in the circuit board (12) with the light emitting portion or lens (34) extending from one of the surfaces (14 or 16) of the circuit board (12) and the heat sink (28) extending from the other one of the surfaces (14 or 16) of the circuit board (12). A thermal coupling agent (36 or 38) is disposed between the heat sink (28) and the heat dissipater (30) for providing a full thermal path between the heat sink (28) and the heat dissipater (30). A thermally insulating cap (40) is disposed around the heat sink (28) during soldering.

Une carte de circuits imprimés (12) présente un trou (32) débouchant qui entoure chacune des multiples DÉL (20, 22 ou 24). Un radiateur (28) intégré à chaque DÉL (20, 22 ou 24) est placé en contact thermique avec un dissipateur thermique (30) pour écouler la chaleur, des DÉL (20, 22 ou 24) au dissipateur thermique (30). Chaque DÉL (20, 22 ou 24) dépasse de la poignée (32) de la carte de circuits imprimés (12), la partie électroluminescente ou la lentille (34) dépassant de l'une des surfaces (14 ou 16) de la carte de circuits imprimés (!2), et le radiateur (28) dépassant de l'une des surfaces (14 ou 16) de la carte de circuits imprimés (12). Un agent d'accouplement thermique (36 ou 38) est placé entre le radiateur (28) et le dissipateur thermique (30) pour assurer un trajet thermique complet entre le radiateur (28) et le dissipateur thermique (30). Un capuchon thermo-isolant (40) est placé autour du radiateur (28) durant le soudage.

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