Laminar board for the production of printed circuits,...

H - Electricity – 05 – K

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H05K 1/03 (2006.01) H05K 1/02 (2006.01) H05K 1/05 (2006.01) H05K 3/00 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2139824

LAMINAR BOARD FOR THE PRODUCTION OF PRINTED CIRCUITS, PRINTED CIRCUIT MADE WITH THE SAID BOARD, AND METHOD FOR ITS FABRICATION ABSTRACT A laminar board for printed circuits is described, comprising a base layer (1) made of a material with a high coefficient of thermal conduction and, on at least one side (1B) of the said base layer, a coating (13) of electrically insulating material forming the surface for the application of the conducting tracks (11) of the printed circuit. The base layer (1) has at least one deformed area with a depression (3A) on one side (1A) and a corresponding projection (3B) on the opposite side (1B), the insulating coating (13) being applied to the side (1B) on which the said projection (3B) is disposed, forming a surface substantially free of discontinuities, with a lesser thickness at the position of the said projection (3) and a greater thickness in the areas adjacent to the said projection; the power components (15) of the circuit are fitted over the projection (3B). (Fig. 3)

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