Laminar structure

B - Operations – Transporting – 01 – D

Patent

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Details

B01D 39/20 (2006.01) A61F 2/28 (2006.01) B01D 39/10 (2006.01) B01D 46/24 (2006.01) C25D 1/08 (2006.01) C25D 1/20 (2006.01)

Patent

CA 2384942

A laminar structure (17) comprising a deposited metal, the structure having microholes (17a) extending between a first surface and a second surface thereof, each microhole having a wall which meets the first surface with a rounded edge or tapered configuration in such a manner that the first surface is substantially smooth.

L'invention concerne une structure laminaire (17) comprenant un dépôt métallique. Ladite structure présente des microperforations (17a) s'étendant entre une première surface et une seconde surface, chaque microperforation comportant une paroi atteignant la première surface sous la forme d'un bord arrondi ou d'une configuration effilée, de manière que cette première surface soit sensiblement lisse.

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