Laminate for electroless metallization, a printed circuit...

Details Laminate for electroless metallization, a printed circuit... Laminate for electroless metallization, a printed circuit...

C - Chemistry, Metallurgy

23

C

117/150, 356/19,

C23C 18/18 (2006.01) C08G 73/02 (2006.01) C23C 18/20 (2006.01) C23C 18/30 (2006.01) C23C 18/31 (2006.01) C23C 18/40 (2006.01) C23C 18/42 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2030499

ACR 2215 LAMINATE FOR ELECTROLESS METALLIZATION, A PRINTED CIRCUIT PROVIDED WITH SAME, AND A PROCESS FOR THE MANUFACTURE OF SUCH A LAMINATE ABSTRACT A laminate for electroless metallization comprising a substrate and one or more layers of a polyamine polymer of which at least the layer adjacent to the substrate is a crosslinked polymer. Metallized products comprising said laminate exhibit an improved metal peel strength. The preparation of a laminate of the above type involves a modification step in which the polyamine polymer is crosslinked. Additionally, the modification step serves to tailor the complexing activity of the substrate. The preferred polyamine polymer is polyethylene imine, which preferably is modified using glutaraldehyde.

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