Laminate for improved bonding

B - Operations – Transporting – 32 – B

Patent

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Details

B32B 27/32 (2006.01) B65D 65/40 (2006.01)

Patent

CA 2477747

A laminate structure is provided that results in an improvement in bond performance over existing laminates for applications in which hot melt adhesive is used. The laminate structure includes an inorganic filler loaded into polyolefin to increase the heat transfer and bond strength of the hot melt adhesive to the laminate substrate at lower temperatures than polyolefin alone.

L'invention concerne une structure de laminé présentant une amélioration des performances adhésives sur des laminés existants, pour des applications dans lesquelles un adhésif thermofusible est utilisé. Ladite structure de laminés comprend une charge inorganique chargée dans la polyoléfine, ceci permettant d'augmenter le transfert de chaleur et la résistance à l'adhésion dudit adhésif thermofusible au substrat de laminé à basse température, par rapport à la polyoléfine seule.

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