Laminate for multi-layer printed circuit

Details Laminate for multi-layer printed circuit Laminate for multi-layer printed circuit

H - Electricity

05

K

H05K 1/02 (2006.01) H05K 3/46 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2360323

A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate (12) formed of a first polymeric material. At least one layer of a flash material (14) is applied to a first side of the film substrate. At least one layer of copper (16) is disposed on the layer of flash material. An adhesive layer (18) formed of a second polymer material has a first surface that is attached to a second side of the film substrate.

L'invention concerne un stratifié à utiliser en tant que stratifié de surface dans une carte de circuit imprimé multicouche. Ledit stratifié est constitué d'un substrat (12) en film, constitué d'un premier matériau polymère. Au moins une couche d'un matériau flash (14) est appliquée sur un premier côté dudit substrat. Au moins une couche de cuivre (16) est disposée sur la couche de matériau flash. Une couche adhésive (18) constituée d'un second matériau polymère possède une première surface fixée au second côté dudit substrat.

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