Laminate for printed circuit boards

Details Laminate for printed circuit boards Laminate for printed circuit boards

C - Chemistry, Metallurgy

01

F

C01F 7/02 (2006.01) B32B 5/28 (2006.01) B32B 17/04 (2006.01) B32B 27/18 (2006.01) C09K 21/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2274952

The present invention relates to printed circuit board laminates which are characterized by improved thermal stability. The improved properties are attributed to the use of a novel aluminium hydroxyde which is described by the molecular representation: Al2O3.nH2O where n > 2.6 and < 2.9.

L'invention concerne des laminés conçus pour des cartes de circuits imprimés et caractérisés par leur stabilité thermique améliorée. On attribue ces propriétés améliorées à l'utilisation d'un hydroxyde d'aluminium nouveau représenté par la formule moléculaire suivante: Al¿2?O¿3?.nH¿2?O dans laquelle n?2,6 et ?2,9.

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