Laminated cylindrical backplane

Details Laminated cylindrical backplane Laminated cylindrical backplane

H - Electricity

05

K

H05K 7/00 (2006.01) G06F 13/40 (2006.01) H05K 7/14 (2006.01) H01R 9/09 (1995.01) H01R 23/70 (1995.01)

Patent

CA 2164351

A laminated cylindrical backplane is constructed using disks with a conductive material mounted on a top surface, and a conductive material mounted on a secondsurface. Each disk and its conductive surfaces are separated from adjacent disks and their conductive surfaces by a dielectric material. The laminated structure forms a cylindrical backplane where circuit cards are radially mounted to the backplane by inserting the cards into slots in the perimeter of the cylindrical structure. The slots contain contacts where similarly positioned contacts of a particular disk are electrically connected to form a bus structure. As a result, similarly positioned conductive surfaces on circuit cards are electrically connected when the cards are inserted into the slots.

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