Laminated multilayer structure

B - Operations – Transporting – 32 – B

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154/140, 154/126

B32B 15/08 (2006.01) B32B 27/08 (2006.01) C08L 51/06 (2006.01) C09D 151/06 (2006.01)

Patent

CA 1149718

Abstract of the Disclosure The present invention relates to a laminated multilayer structure composed of a grafted high-density polyethylene resin layer directly attached to a layer of a resin such as a polyamide resin, a saponified coploymer of ethylene and vinylacetate or a polyester resin, or to a metal layer. This structure has improved bond strength between layers and is useful, for example, in the fields of packaging materials and panels of buildings. The laminated multilayer structure is characterized in that the graft- ed high density polyethylene resin layer is composed of: (a) 97 to 50 parts by weight, per 100 parts by weight of the resins (a) and (b) combined, of a high-density polyethylene resin having a density of 0.945 to 0.970 g/cm3 and being grafted with an aliphatic dicarboxylic acid or its functional derivative, with or without a high-density polyethylene resin having a density of 0.945 to 0.970 g/cm3, (b) 3 to 50 parts by weight, per 100 parts by weight of the resins (a) and (b) combined, of an ethylene/?-methyl-1- pentene copolymer having an ethylene content of 53 to 99.5 mol% and a melt index at 190°C of 0.1 to 10 g/10 min., and (c) 0 to 20 parts by weight, per 100 parts by weight of the resins (a) and (b) combined, of a rubbery synthetic polymer or copolymer.

347718

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