H - Electricity – 02 – K
Patent
H - Electricity
02
K
336/49
H02K 3/26 (2006.01) H02K 5/22 (2006.01)
Patent
CA 1281389
ABSTRACT OF THE DISCLOSURE A laminated printed coil structure comprising a wiring board having an insulating substrate, lead terminals and connecting pad portions connected to the lead terminals and formed on one surface of the insulating substrate, and a plurality of printed coil elements each having an insulating layer, coil patterns, a pair of terminals for the coil patterns and a connecting pad electricallky isolated from the terminals formed on the insulating layer. The printed coil elements are piled up and laminated on the wiring board such that the connecting pad portions of the wiring board, the terminals of the coil patterns on one of the printed coil elements and the connecting pad on another printed coil element are placed in alignment, and that each one terminal for the coil pattern on each of the printed coil elements to a respective lead terminal is connected, and that each coil pattern is from thence led out to the lead terminals of the wiring board.
529064
Kawahara Takanori
Koizumi Takaaki
Muramoto Shiyouichi
Osawa Kenji
Watanabe Yoshio
Gowling Lafleur Henderson Llp
Sony Corporation
LandOfFree
Laminated-print coil structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laminated-print coil structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminated-print coil structure will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1173543