Laminated semiconducter assembly

H - Electricity – 01 – L

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356/110, 347/4

H01L 23/16 (2006.01) H01L 25/07 (2006.01)

Patent

CA 1237823

B01537 LAMINATED SEMICONDUCTOR ASSEMBLY Abstract The problem of compensating for dimensional differences occuring in the length of adjacent stacks of semiconductors or other electronic components in an electrical assembly of such components is avoided through the use of a plurality of housing sections one for each stack with each housing section being comprised of stacked thin sheets of electrically conductive or electrically insulating material. Some of the sheets have cutouts to receive semiconductors. The stacks are tied together by ribbon-like flexible tabs integral with at least some of the sheets and interconnecting the housing sections. The tabs are constructed to be deformable generally independently of the other of the tabs.

501904

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Laminated semiconducter assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laminated semiconducter assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminated semiconducter assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1184458

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.