C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
154/137
C08G 59/04 (2006.01) B32B 27/12 (2006.01) B32B 27/38 (2006.01) C08G 59/32 (2006.01)
Patent
CA 1277579
ABSTRACT Laminates are prepared from reinforced epoxy resin compositions comprising (A) a reinforcing material such as fiberglass, (B) one or more epoxy resins such as a hydrocarbon-phenol epoxy resin and (C) one or more epoxy resin curing agents such as a hydrocarbon-phenol resin or phenol-formaldehyde novolac resin. These laminates are particularly suitable for use in electrical applications such as the manufacture of printed circuit boards.
530072
Aldrich Dale J.
Bogan Gary W.
Lucas Peter A.
Monnerat Georgia A.
Smart & Biggar
The Dow Chemical Company
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