Laminating adhesive hardenable by radiation and use of same

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 201/02 (2006.01) C08F 283/00 (2006.01) C09J 11/00 (2006.01)

Patent

CA 2316197

The invention relates to the use of an adhesive containing at least two components A and B for producing composite film materials. The component A present in the adhesive contains a compound having at least one vinyl ether group with a molecular weight of more than 400, and component B contains a photo-initiator which after irradiation with light at a wave length of between 100 and 600 nm initiates a polymerisation of component A. The invention yields composite film materials having high heat-resistance and high flexibility. The invention further relates to an adhesive suitable, for example, for the production of composite film materials.

L'invention concerne l'utilisation d'un adhésif contenant au moins deux constituants A et B pour produire des films composites. Le constituant A contenu dans l'adhésif renferme un composé avec au moins un groupe éther vinylique présentant un poids moléculaire supérieur à 400, et le constituant B renferme un photo-initiateur qui, après exposition à de la lumière d'une longueur d'onde de 100 à 600 nm, amorce une polymérisation du constituant A. L'utilisation de l'adhésif selon l'invention donne des films composites présentant une résistance thermique élevée et une grande souplesse. L'invention concerne également un adhésif convenant par exemple à la fabrication de films composites.

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