C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/62 (2006.01) C08J 5/12 (2006.01) C09J 11/00 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2316198
The invention relates to the use of an adhesive containing components A, B and C, where component A contains a compound with at least one epoxy group, component B contains a compound with at least 3 OH groups and component C contains a photo-initiator which after irradiation with light at a wave length of between 100 and 600 nm initiates a polymerisation of components A and B, for the production of films and materials. Use of the adhesive according to the invention yields composite films presenting high heat-resistance, low migration and high flexibility.
L'invention concerne l'utilisation d'un adhésif renfermant les constituants A, B et C, le constituant A contenant un composé avec au moins un groupe époxy, le constituant B contenant un composé avec au moins 3 groupes OH et le constituant C contenant un photo-initiateur qui, après exposition à de la lumière d'une longueur d'onde de 100 à 600 nm, amorce une polymérisation des constituants A et B, pour la production de films et de matériaux. L'utilisation de l'adhésif selon l'invention donne des films composites présentant une résistance thermique élevée, une faible migration et une grande souplesse.
Drobnik Michael
Henke Guenter
Huebener Achim
Henkel Kommanditgesellschaft Auf Aktien
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
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