Laminating film incorporating a chip

Details Laminating film incorporating a chip Laminating film incorporating a chip

B - Operations, Transporting

32

B

B32B 27/04 (2006.01)

Patent

CA 2633154

The present invention relates to a laminating film comprising: a flexible film, which is at least partially transparent; a flexible chip, which is fixed to the face of the film; and a thickness-compensating layer, which covers the film at least partly around the chip.

La présente invention concerne un film de pelliculage comportant : un film souple, au moins partiellement transparent, une puce flexible, fixée sur une face du film, une couche compensatrice d'épaisseur, recouvrant le film au moins partiellement autour de la puce.

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