Laminating method

Details Laminating method Laminating method

B - Operations, Transporting

32

B

154/41, 154/89

B32B 15/14 (2006.01) B29C 35/02 (2006.01) B29C 43/14 (2006.01) B29C 43/52 (2006.01) B29C 70/08 (2006.01) B29C 70/34 (2006.01) B32B 17/04 (2006.01) H05K 3/02 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1040993

LAMINATING METHOD ABSTRACT OF THE DISCLOSURE Method of laminating pluralities of sheets as unitary panels with heat and pressure curable adhesive in which unlaminated, uncured sheet pluralities are alternately stacked in a press lay-up with partially semicured unitary sheet pluralities and the entire layup is subjected to heat and pressure for a time sufficient to partially cure the originally uncured sheet pluralities and bring the interspersed, partially cured sheet pluralities to full cure. Thereafter, the newly partially cured and fully cured units are removed and the partially cured units used alternately with new uncured sheet pluralities. This method obviates the need for planishing plates heretofore used to produce smooth surfaces on metal foil covered core units for printed circuit manufacture.

224573

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