Laminating resin having low organic emissions

Details Laminating resin having low organic emissions Laminating resin having low organic emissions

C - Chemistry, Metallurgy

08

F

C08F 222/20 (2006.01) C08F 212/12 (2006.01) C08F 220/30 (2006.01)

Patent

CA 2137351

A lamination resin comprising (A) an acrylated or methacrylated cycloaliphalic epoxide, (B) an acrylated or methacrylated alkoxylated bisphenol-A, in a weight ratio of (A) to (B) of about 3 to 1 to about 1 to 5, and (C) about 5%, to about 50%, based on the total composition, cyclohexyl methacrylate. Vinyl toluene and ethylene glycol dimethacrylate are also used to modify certain properties of the resin.

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