Lamination of integrated circuit packages

Details Lamination of integrated circuit packages Lamination of integrated circuit packages

H - Electricity

01

L

356/143

H01L 23/15 (2006.01) H01L 21/50 (2006.01) H01L 23/02 (2006.01)

Patent

CA 2036169

LAMINATION OF INTEGRATED CIRCUIT PACKAGES ABSTRACT OF THE DISCLOSURE Laminated integrated circuit package are prepared using an apparatus and process that consolidates the package without the use of fluids and nonconforming dies. A plurally of laminates from which the package is formed are stacked on a base. A pressure transfer membrane having two layers, a silicone rubber release layer adjacent the stack and a urethane rubber separating layer, is placed over the stack of laminates. A solid pressurizing medium, preferably a body of Sorbothane retained by a latex diaphragm in a cavity in a pressurizing tool, is pressed against the pressure transfer membrane and the underlying stack to consolidate the stack of laminates. Preferably, heat is applied simultaneous with the pressing to aid in consolidation, and the region between the pressure transfer membrane and the stack of laminates is evacuated to remove air bubbles that might locally prevent lamination.

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