Lamp annealing apparatus and lamp annealing method

H - Electricity – 01 – L

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148/3.4

H01L 21/324 (2006.01) H01L 21/00 (2006.01) H01L 21/477 (2006.01) H02K 9/00 (2006.01)

Patent

CA 2040946

ABSTRACT OF THE DISCLOSURE A lamp annealing technique for a semiconductor wafer is disclosed. In a heating step of an annealing process, cooling gas is flown toward a periphery of the semiconductor wafer, and in a steady state step and a cooling step, cooling gas is blown toward a center of the semiconductor wafer. In this manner, a temperature difference between the center and the periphery of the semiconductor wafer is eliminated throughout the annealing process.

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