B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
B23K 26/00 (2006.01) B23K 26/40 (2006.01) B26D 9/00 (2006.01) B27B 23/00 (2006.01) B27L 5/00 (2006.01) B27L 5/06 (2006.01) B27L 7/00 (2006.01) B27L 7/06 (2006.01)
Patent
CA 2259700
The present invention provides a method and apparatus for cutting wood or other materials by separating the material along a line of controlled failure through the application of mechanical force in combination with laser light to break molecular bonds holding the material together along the line of controlled failure. A preferred embodiment of the cutting apparatus is a generally broad wedge-shaped blade having planar lower and upper surfaces which converge toward each other to terminate along a leading edge. The blade is generally hollow with a cavity for passing optical fibers carrying laser light to a transparent window attached to the leading edge of the blade. Laser light passes through the window and is directed to a line of controlled failure in the material being cut to break the molecular bonds and locally weaken the material.
Fetherstonhaugh & Co.
Whittenbury Clive G.
LandOfFree
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