Laser beam cutting method for cutting laminates for applying...

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 26/10 (2006.01) A61F 13/02 (2006.01) A61K 9/70 (2006.01) B23K 26/40 (2006.01)

Patent

CA 2308598

The invention relates to a process for cutting laminates intended for application to the skin, comprising the following steps: - a laminate comprising at least one film and at least one further layer is supplied, - said laminate is transported to a cutting area of a laser beam cutting arrangement, whereby it is kept flat in the cutting area under a tension of between 0.1 N/m and 1 × 4 N/m, - and said laminate is cut into or cut through by means of laser beams.

L'invention concerne un procédé pour découper des stratifiés s'appliquant sur la peau, consistant à préparer un stratifié constitué d'au moins un film et d'au moins une autre couche, à acheminer ce stratifié jusqu'à une zone de découpage d'un dispositif de découpage par faisceau laser, où il est maintenu à plat sous une tension se situant entre 0,1 N/m et 1 x 10<4> N/m, et à utiliser le faisceau laser pour recouper ou entailler le stratifié.

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