H - Electricity – 01 – L
Patent
H - Electricity
01
L
327/1.3
H01L 21/60 (2006.01) B23K 1/005 (2006.01) B23K 26/08 (2006.01) H01L 21/00 (2006.01) H01L 21/68 (2006.01) H01L 21/98 (2006.01) H01L 23/50 (2006.01)
Patent
CA 1311276
LASER BONDING APPARATUS AND METHOD Abstract of the Disclosure A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.
589004
Andrews Daniel M.
Simmons Richard L.
Spletter Phillip J.
Andrews Daniel M.
Borden Ladner Gervais Llp
Microelectronics And Computer Technology Corporation
Simmons Richard L.
Spletter Phillip J.
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