Laser cutting method and equipment, with means for modifying...

Details Laser cutting method and equipment, with means for modifying... Laser cutting method and equipment, with means for modifying...

B - Operations, Transporting

23

K

B23K 26/06 (2006.01) B23K 26/38 (2006.01)

Patent

CA 2734697

A method of cutting a workpiece (30) to be cut by a laser beam (10), in which an incident laser beam (10) is generated that has an initial beam parameter product (BPP), given by means of a laser source (1), preferably an ytterbium-doped or erbium-doped fibre laser source, coupled to at least one optical fibre for conveying the beam. Said incident laser beam (10) is brought to a focusing head (3, 4) comprising at least one optical focusing device (14). The incident laser beam (10) is focused by means of said optical focusing device (14), so as to obtain a focused laser beam, and the workpiece (30) is cut by means of the focused laser beam. According to the invention, the quality factor of the incident laser beam (10) is adjusted or modified by means of an optical device (16) designed to be able to modify or vary the BPP of a laser beam so as to obtain a modified focused laser beam (10b) having a modified BPP which is different from the BPP of said incident laser beam. Associated equipment for implementing said method.

La présente demande se rapporte à un procédé de découpe par faisceau laser (10) d'une pièce (30) à couper, dans lequel on génère un faisceau laser (10) incident présentant un facteur de qualité (BPP) initial donné au moyen d'une source laser (1), de préférence à fibres dopées à l'ytterbium ou à l'erbium, couplée à au moins une fibre optique (2) de convoyage de faisceau; on amène ledit faisceau laser (10) incident jusqu'à une tête de focalisation (3, 4) comportant au moins une optique de focalisation (14); on focalise le faisceau laser (10) incident au moyen de l'optique de focalisation (14), de manière à obtenir un faisceau laser focalisé, et on découpe la pièce (30) au moyen du faisceau laser focalisé. Selon l'invention, on ajuste ou on modifie le facteur de qualité du faisceau laser incident (10) au moyen d'un dispositif optique (16) apte à et conçu pour modifier ou agir sur le BPP d'un faisceau laser, de manière à obtenir un faisceau laser focalisé modifié (10b) présentant un BPP modifié qui soit différent du BPP dudit faisceau laser incident. La présente demande se rapporte aussi à une installation associée pour la mise en oeuvre dudit procédé.

Affiliated with

Also associated with

Rating

Laser cutting method and equipment, with means for modifying... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser cutting method and equipment, with means for modifying..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser cutting method and equipment, with means for modifying... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1893413