Laser cutting of materials

Details Laser cutting of materials Laser cutting of materials

B - Operations, Transporting

23

K

B23K 26/12 (2006.01) B23K 26/06 (2006.01) B23K 26/067 (2006.01) B23K 26/14 (2006.01)

Patent

CA 2182552

An apparatus for cutting a workpiece comprises optical means 4 located in a single cutting head 6 for splitting a beam of laser energy into two separate beams 8, 10. The cutting head 6 includes an inlet 16 for oxygen under pressure and a nozzle 14 for the outlet of the oxygen. At least one split beam 8 is focused at a location above the surface of the workpiece such that when in use the area on the surface of the workpiece impinged by the split beam 8 is greater than the area being impinged upon by the oxygen when leaving the nozzle 14.

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