Laser cutting of thin metal parts with a dual-focus lens

B - Operations – Transporting – 23 – K

Patent

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B23K 26/067 (2006.01) B23K 26/12 (2006.01)

Patent

CA 2531883

L'invention porte sur un procédé de coupage par faisceau laser d'une pièce métallique ayant une épaisseur inférieure à 5 mm, dans lequel on met en oeuvre une lentille à double focalisation permettant de focaliser le faisceau laser en au moins un premier (PF1) et un deuxième (PF2) points de focalisation distincts l'un de (autre, et situés sur l'axe du faisceau, caractérisé en ce que la lentille présente une longueur focale (FL) comprise entre 80 et 135 mm.

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