H - Electricity – 01 – S
Patent
H - Electricity
01
S
H01S 5/022 (2006.01) H01L 33/00 (2006.01) H01S 5/024 (2006.01)
Patent
CA 2359264
A laser diode module of the invention can release heat radiated from a laser diode efficiently, and is of small size and small power consumption. An outer surface (15) of a bottom plate (2) of a package (7) is formed to be a board mounting surface to be mounted on a printed board (20) . A base (6) is fixed to the inner wall surface (9) side of the top plate (8) of the package (7) and a laser diode (3) is fixed to the base (6). In the invention, an exemplary configuration where heat radiated from the laser diode is released effectively is formed by disposing a heat radiating unit (4) on the outer surface (16) side of the top plate (8) of the package (7), for example. The heat radiating unit (4) is formed by disposing a plurality of heat radiating fins (5) arranged at intervals, for example. The configuration containing the heat radiating unit (4) releases heat radiated from the laser diode (3) through the base (6), the top plate (8) and the heat radiating unit (4).
Iwase Masayuki
Kato Tomoya
Murata Hideaki
Shimizu Takeo
Freedman & Associates
The Furukawa Electric Co. Ltd
LandOfFree
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