Laser drilling

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 27/18 (2006.01) B23K 26/18 (2006.01) C08L 33/12 (2006.01)

Patent

CA 2041356

A material is described for preventing the occurrence of damage to the backwall of a cavity within a component during laser drilling of holes into said component. The material comprises an acrylic resin having polytetrafluoroethylene dispersed within it and is polymerized before laser drilling. A method for preventing such backwall damage occurring during laser drilling using this material is also described and the method comprises the steps of at least partially filling the cavity in the component with a material comprising an acrylic resin monomer and polytetrafluoroethylene (PTFE), the monomer incorporating a suitable initiator to promote polymerisation, and allowing said material to polymerise in situ in the cavity prior to laser drilling.

L'invention est un matériau servant à empêcher l'endommagement de la paroi arrière d'une cavité à l'intérieur d'un composant durant le perçage de trous dans ce composant au moyen d'un laser. Ce matériau contient une résine acrylique dans laquelle un polytétrafluoroéthylène est en dispersion, et qui est polymérisée avant le perçage au laser. Une méthode utilisant ce matériau pour empêcher l'endommagement de la paroi arrière durant les opérations de perçage au laser est également divulguée. Dans cette méthode, la cavité qui est à l'intérieur du composant est au moins partiellement remplie avec un matériau contenant un monomère de résine acrylique et un polytétrafluoroéthylène, ce monomère contenant un agent d'amorçage approprié pour faciliter la polymérisation; le perçage au laser se fait pour permettre la polymérisation de ce matériau in situ dans la cavité.

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