Laser drilling holes in a cylindrical workpiece

Details Laser drilling holes in a cylindrical workpiece Laser drilling holes in a cylindrical workpiece

B - Operations, Transporting

23

K

B23K 26/04 (2006.01) B23K 26/08 (2006.01)

Patent

CA 2343189

A process is provided for laser drilling a plurality of holes in a row around the circumference of a cylindrical workpiece (1) by continuously rotating the workpiece, sequentially impacting each hole location with a laser pulse and repetitively and sequentially impacting each hole location with a subsequent laser pulse to drill through the workpiece.

L'invention concerne un procédé de perçage par laser de plusieurs orifices, en rangée, sur la circonférence d'une pièce à travailler cylindrique (1). Ledit procédé consiste à faire tourner en continu la pièce à travailler, à envoyer séquentiellement une impulsion sur chaque emplacement d'orifice et à envoyer de manière répétitive et séquentielle une autre impulsion laser sur chaque emplacement d'orifice de sorte que la pièce à travailler soit percée.

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