Laser-enhanced jet-plating and jet-etching: high speed...

Details Laser-enhanced jet-plating and jet-etching: high speed... Laser-enhanced jet-plating and jet-etching: high speed...

C - Chemistry, Metallurgy

25

D

149/18, 204/40,

C25D 5/02 (2006.01) C23F 1/00 (2006.01) C25D 5/08 (2006.01) C25F 3/02 (2006.01) C25F 3/14 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1259947

ABSTRACT OF THE DISCLOSURE This metal deposition/material removal technique modifies free-standing or submerged jet plating with an electromagnetic energy beam such as an intense laser beam, directed collinearly along the jet. Experiments were made to deposit gold contact areas on nickel plated beryllium-copper substrates used for microelectronic connectors. The deposits are found to be crack-free and dense, possessing excellent adhesion to the substrate. Deposition rates for 0.05 cm diameter gold spots are on the order of 10 micrometers per second. Also disclosed is a laser jet chemical treatment system wherein relative motion between a cathodically connected workpiece and a fluid jet is provided. The laser beam which is collinear with the jet, cooperates with it to enhance plating or etching rate on the surface of the workpiece.

454199

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