Laser femtosecond microtome for cutting out a material slice...

B - Operations – Transporting – 23 – K

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Details

B23K 26/073 (2006.01) A61F 9/01 (2006.01) B23K 26/40 (2006.01)

Patent

CA 2628597

The invention relates to a laser femtosecond microtome for cutting out at least one slice of material from a material block by means of a focused laser beam, wherein said material block comprises a front surface and a slice carrying said front surface, the slice extends at least partially on a X, Z plane perpendicular to an axis Z of the block thickness, is separated from the remaining part of the block by a cleavage surface formed by an assembly of bubbles brought together and each bubble is formed in the focus area of at least one convergent laser beam pulse of an optical axis L. According to said invention, the optical axis L of the laser beam convergent part (3) forms an angle ranging from 45° to + 45° with respect to the X, Z plane. An ellipsoid-shaped focus area has the smallest axis thereof in the direction of the axis Y.

L'invention concerne un microtome laser femtoseconde pour découpe par un faisceau laser focalisé d'au moins une tranche de matière dans un bloc de matériau, le bloc présentant une surface frontale et la tranche emportant ladite surface frontale, la tranche s'étendant au moins en partie sensiblement dans un plan X, Z perpendiculaire à un axe Y d'épaisseur du bloc, la tranche étant séparée du reste du bloc par une surface de clivage formée par la réunion d'un ensemble de bulles, chaque bulle étant formée dans une zone de focalisation d'au moins une impulsion du faisceau laser convergent d'axe optique L. Selon l'invention, l'axe optique L de la partie convergente (3) du faisceau laser fait un angle compris entre - 45° et +45° par rapport au plan X, Z. La zone de focalisation de forme ellipsoïde a son plus petit axe dans la direction de l'axe Y.

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