Laser induced flow of integrated circuit structure materials

B - Operations – Transporting – 23 – K

Patent

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Details

327/1.1, 117/74.

B23K 26/00 (2006.01) H01L 21/268 (2006.01) H01L 21/3105 (2006.01)

Patent

CA 1174285

ABSTRACT OF THE DISCLOSURE A tunable CO2 gas laser is used to selectively heat various glass materials or silicon-oxygen bonded materials to elevated temperatures while maintaining an active device region at relatively low temperatures, to, for example, induce densification and/or flow of the glass materials or silicon-oxygen bonded materials to round off sharp edges and stops.

369491

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