Laser micromachining and methods of same

Details Laser micromachining and methods of same Laser micromachining and methods of same

B - Operations, Transporting

23

K

B23K 26/14 (2006.01) B23K 26/36 (2006.01) B41J 2/455 (2006.01)

Patent

CA 2487209

The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.

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