Laser package with reversed laser diode

H - Electricity – 01 – S

Patent

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Details

H01S 5/042 (2006.01) H01S 5/022 (2006.01) H01S 5/40 (2006.01)

Patent

CA 2210527

A laser package (10) includes a housing, (11, 12, 13, and 14) and a subassembly (20) to which the critical components of the laser package (10) are mounted. The subassembly (20) is structured to preserve component alignment even in the presence of thermal excursions by ensuring that any movement which might occur effects all the components in a way to preserve alignment. The subassembly (20) is easily removable from the housing and thus permits replacement if a failure should occur. A reserve diode is included to provide a path for reverse currents which otherwise would be damaging to the active laser diode.

Cette invention concerne un boîtier laser (10) comprenant un boîtier (11, 12, 13 et 14), ainsi qu'un sous-ensemble (20) sur lequel sont montés les composants cruciaux du boîtier laser (10). Ce sous-ensemble (20) est conçu de manière à maintenir l'alignement des composants, même lors d'écarts thermiques, de sorte que tout mouvement affecte l'ensemble des composants tout en maintenant leur alignement. Ce sous-ensemble (20) peut être facilement retiré du boîtier, ce qui permet de remplacer un élément en cas de panne. Ce système comprend également une diode à courant inverse qui assure un trajet électrique pour les courants inverses, lesquels, sans cela, pourraient endommager la diode laser active.

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