Laser peening process and apparatus with reduction of...

Details Laser peening process and apparatus with reduction of... Laser peening process and apparatus with reduction of...

C - Chemistry, Metallurgy

21

D

C21D 1/09 (2006.01)

Patent

CA 2239553

The present invention provides a method of laser shock processing that can be used in a production environment that increases the peak pressure of the shock wave applied to the workpiece that increases residual compresses stresses therein. Such improvement is created by a reduction of dielectric breakdown of the transparent overlay layer utilized. The method includes the steps of applying a transparent overlay such as water over the workpiece and reducing or limiting the thickness of the transparent overlay material. An alternate embodiment of the invention to reduce dielectric breakdown incorporates the use of a changing or circularly polarized laser beam as opposed to a linearly polarized laser beam.

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