Laser processing of a locally heated target material

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 26/00 (2006.01) B23K 26/14 (2006.01) B23K 26/16 (2006.01) B23K 26/18 (2006.01)

Patent

CA 2543463

A method and laser system effect rapid removal of material from a workpiece (20) by applying heating energy in the form of a light beam (28) to a target location (16) on the workpiece to elevate its temperature while maintaining its dimensional stability. When the target portion of the workpiece is heated, a laser beam (12) is directed for incidence on the heated target location. The laser beam preferably has a processing laser output that is appropriate to effect removal of the target material from the workpiece. The combined incidence of the processing laser output and the heating energy on the target location enables the processing laser output to remove a portion of the target material at a material removal rate that is higher than the material removal rate achievable when the target material is not heated.

L'invention concerne une méthode et un système de laser permettant un retrait rapide de matière d'une pièce (20) par l'application d'énergie chauffante, sous la forme d'un faisceau lumineux (28) sur un emplacement cible (16) d'une pièce, pour élever la température de cette pièce, tout en maintenant sa stabilité dimensionnelle. Lorsque la partie cible de la pièce est chauffée, un faisceau laser (12) est dirigé pour une incidence sur l'emplacement cible chauffé. Ce faisceau laser présente de préférence une sortie laser de traitement appropriée pour effectuer un retrait de matière cible de la pièce. L'incidence combinée de la sortie laser de traitement et de l'énergie chauffante, sur l'emplacement cible, permet à la sortie laser de traitement de retirer une partie de matière cible, à une vitesse de retrait de matière supérieure à une vitesse de retrait de matière pouvant être obtenue lorsque la matière cible n'est pas chauffée.

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