Laser processing of conductive links

Details Laser processing of conductive links Laser processing of conductive links

B - Operations, Transporting

23

K

B23K 26/06 (2006.01) B23K 26/38 (2006.01)

Patent

CA 2688771

A method of laser-based material processing comprising: generating a laser beam having a narrow emission spectrum characterized by a full width at half maximum intensity of less than about 1 nanometer during a first time interval; controllably modifying a characteristic of the laser beam during the time interval to produce one or more pulses without substantially broadening the emission spectrum; and delivering and focusing at least one of the one or more pulses onto at least one target structure during motion of the at least one structure relative to the at least one pulse.

L'invention concerne un procédé de traitement de matériau à base de laser comprenant la génération d'un faisceau laser ayant un spectre d'émission étroit caractérisé par une pleine largeur à une moitié de l'intensité maximale inférieure à environ 1 nanomètre pendant un premier intervalle de temps ; la modification contrôlable d'une caractéristique du faisceau laser pendant l'intervalle de temps pour produire une ou plusieurs impulsions sans élargir sensiblement le spectre d'émission ; et les missions et la focalisation d'au moins l'une des une ou plusieurs impulsions sur au moins une structure cible pendant le déplacement de la au moins une structure par rapport à la au moins une impulsion.

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